Method of testing semiconductor wafers with non-penetrating probes
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United States of America Patent
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Issued Date -
Oct 13, 2005
app pub date -
Apr 5, 2005
filing date -
Apr 8, 2004
priority date (Note) -
Abandoned
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Abstract
A sheet resistance test of a wafer or sample can be performed by causing a plurality of spaced contacts, each of which either does not form oxides thereon or which forms conductive oxides thereon, to touch a surface of the wafer without penetrating or damaging the surface. An electrical stimulus is then applied to the wafer via one or more of the contacts and the electrical response of the semiconducting material to the electrical stimulus is detected via one or more of the contacts. At least one electrical property of the wafer can be determined from the measured response and the applied electrical stimulus.
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