Blister pack system
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United States of America Patent
Stats
-
Feb 10, 2009
Grant Date -
Oct 13, 2005
app pub date -
Jan 23, 2003
filing date -
Feb 14, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A blister pack system has a printed board, and the outside of the film of the blister pack has individual contact spots each assigned to a respective bag. Individual strip conductors run from each contact spot to a common conductor strip via the respective bag on the outside of the film. When a dragée is removed from a bag, the strip conductor assigned to the bag is interrupted. The printed board has perforations corresponding to the pattern of the bags and contact spots corresponding to the pattern of the contact spots of the blister pack. The contact spots of the board are directed towards the contact spots of the pack while the perforations of the board are directed towards the bags of the board. An edge area of the printed board has connecting contact spots each connected to a contact spot of the printed board via an individual strip conductor.
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