Buffer system for a wafer handling system

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United States of America Patent

SERIAL NO

11066602

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Abstract

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An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

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Patent Owner(s)

Patent OwnerAddress
NOVA MEASURING INSTRUMENTS LTDP O BOX 266 WEIZMANN SCIENCE PARK REHOVOT 7610201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dvir, Eran Givatayim, IL 23 384

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