Module for a data carrier with improved bump counterparts
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United States of America Patent
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May 16, 2006
Issued Date -
N/A
app pub date -
Apr 3, 2003
filing date -
Apr 16, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).
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