Housing for a circuit that is to be implanted in-vivo and process of making the same
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United States of America Patent
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N/A
Issued Date -
Oct 20, 2005
app pub date -
Apr 16, 2004
filing date -
Apr 16, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a biocompatible circuit assembly that includes a circuit encased within a housing. In some embodiments, the housing is a PMMA housing and before the circuit is enclosed within the housing the circuit is encased within a brick of epoxy.
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