Methods and apparatus for controlling rotating magnetic fields
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United States of America Patent
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Issued Date -
Oct 27, 2005
app pub date -
Apr 21, 2005
filing date -
Apr 27, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention relates to methods and apparatus for controlling a rotating magnetic field during processing of a substrate. A sputter target 10 is arranged symmetrically about an axis 11, about which rotates an offset magnetron 12. Magnetron 12 is controlled, relative to the proposed process, such that only complete magnetron rotations are used in the deposition process.
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