System and method for applying, processing, and underwriting student loans
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 27, 2005
app pub date -
Apr 27, 2004
filing date -
Apr 27, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A loan application and processing system for student loans is supported on a server system connect to an Internet. The system includes an academic institution server facility, a financial institution communication server facility, and a Department of Education server facility, along with an interconnected database, email server, and processor, which in combination provide an integrated facility for the application and processing of student loan applications.
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