Methods for producing a light emitting semiconductor body with a luminescence converter element
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United States of America Patent
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Oct 13, 2009
Grant Date -
Nov 3, 2005
app pub date -
Mar 2, 2001
filing date -
Mar 3, 2000
priority date (Note) -
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Abstract
The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body. In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.
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