Chip scale image sensor and method for fabricating the same
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United States of America Patent
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Issued Date -
Nov 17, 2005
app pub date -
Apr 20, 2005
filing date -
Apr 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are a chip scale image sensor and its fabricating method. Such a chip scale image sensor includes a first substrate on which a peripheral circuit is formed, a second substrate which is stacked on the first substrate and on which a pixel array is formed, and global interconnections for electrically connecting the pixel array and the peripheral circuit. That is, since a pixel array and a peripheral circuit are separately formed and then are coupled to each other, there is no need to apply a repetitive fabricating process of forming multilayer metal interconnections to the pixel array. Thus, photosensitivity of the pixel array is not lowered, distances between a photodiode, a color filter and a micro lens can be minimized, and sensitivity of the image sensor can be still more improved due to a wide choice of light transmissive films.
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