Plasma processing apparatus
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United States of America Patent
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Issued Date -
Nov 24, 2005
app pub date -
Mar 13, 2003
filing date -
Mar 20, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is provided a plasma treatment apparatus capable of treating a square shaped substrate having a large area even in the case of using reactive plasma, the plasma treatment apparatus including a waveguide 1, a waveguide antenna 2 made up of slots provided on the H-surface of the waveguide 1, an electromagnetic wave radiation window 4 made of a dielectric, a dielectric space 10 sandwiched between the waveguide 2 and the electromagnetic wave radiation window 4, and generating plasma by using the electromagnetic wave radiated from the waveguide antenna 2 through the electromagnetic wave radiation window 4, wherein an uneven portion 11 is provided on the surface of the waveguide 1 opposite to the electromagnetic wave radiation window 4.
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