LED assembly with vented circuit board
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United States of America Patent
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-
Nov 21, 2006
Grant Date -
Nov 24, 2005
app pub date -
May 18, 2004
filing date -
May 18, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
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