Method for evaluating semiconductor substrate

United States of America Patent

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Issued Date
Nov 24, 2005
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May 23, 2005
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May 21, 2004

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Abstract

A method for evaluating a semiconductor substrate includes the steps of cleaning the semiconductor substrate with SPM, attaching a liquid metal electrode to a surface of the semiconductor substrate, and applying a voltage to the semiconductor substrate.

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Patent Owner(s)

Patent Owner	Address
SUMITOMO MITSUBISHI SILICON CORPORATION	1-2-1 SHIBAURA MINATO-KU TOKYO 105-8634

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G11B:INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BET....

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Inventor Name	Address	# of filed Patents	Total Citations
Yamazaki, Toru	Saga, JP	119	993

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Method for evaluating semiconductor substrate

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United States of America Patent

11134991

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11134991

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