Functionalized urethanes and methods for use thereof
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United States of America Patent
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Issued Date -
Dec 1, 2005
app pub date -
May 2, 2005
filing date -
May 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is based on the discovery that certain functionalized urethane compounds are useful as thermosetting resins for the electronic packaging industry. The functionalized urethane compounds described herein can be cured in a variety of ways, depending on the polymerizable moiety present in the urethane compound. In addition, the functionalized urethane compounds described herein exhibit increased thermal stability relative to known urethane compounds. The functionalized urethane compounds are readily prepared by contacting a hydroxyl-bearing compound with an isocyanate, thereby resulting in a functionalized urethane compound. In addition, the methods described herein for preparing invention urethane compounds are environmentally friendly, requiring no solvent or catalyst.
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