Material analysis including density and moisture content determinations
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United States of America Patent
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May 15, 2007
Grant Date -
Dec 1, 2005
app pub date -
May 12, 2005
filing date -
May 26, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A system, method and program product for determining the in-place engineering properties such as density and moisture content of many varieties of engineering materials, are disclosed. The invention also includes a database, material model and sensor model for use with the above-described aspects. In one embodiment, the invention determines a compaction indication of the material based on an effect of impedance characteristics of the material on an electrical field, and corrects the compaction indication for at least one of a sensor depth-sensitivity inaccuracy and a compaction process inaccuracy. The compaction indication is determined based on a material model, and the corrections are based on mathematical and empirical models of the compaction process and the sensor.
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