Film deposition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Dec 8, 2005
app pub date -
May 26, 2005
filing date -
Jun 4, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Films are deposited on a substrate using a plasma chamber having a target disposed about an axis and a magnetron rotatable about the axis at an adjustable offset from the axis to vary the pattern of ions impinging on the target. In the deposition of the films, a first film of target material is deposited with the magnetron at a first inner-offset position relative to the axis, and in the same chamber, a second film is deposited using a reactive physical vapour deposition process with the magnetron at a second outer offset position. The deposition of the first and second film can occur in any order.
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