Adhesive/spacer island structure for stacking over wire bonded die
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United States of America Patent
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Oct 8, 2013
Grant Date -
Dec 8, 2005
app pub date -
May 20, 2005
filing date -
May 24, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
Adhesive/spacer structures used to adhere a first device, such as a die, or a package, to a second device in a stacked semiconductor assembly, include a plurality of spaced-apart adhesive/spacer islands securing the first and the second devices to one another at a chosen separation. Either or both of the first and second devices can be a die; or, either or both of the devices can be a package. A package includes a die mounted onto and electrically interconnected to, a substrate, and where one package is stacked over either a lower die or a lower package, the upper package may be oriented either so that the die attach side of the upper package faces toward the lower die or lower package substrate or so that the die attach side of the upper package faces away from the lower die or lower package substrate.
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