Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 8, 2005
app pub date -
Jan 6, 2005
filing date -
Jun 8, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An apparatus, method and mold for manufacturing a semiconductor package are provided. The semiconductor package may include at least a semiconductor chip positioned on a substrate, a bonding wire for electrically connecting the semiconductor chip to the substrate, an encapsulant for enclosing the semiconductor chip and sides of the substrate, and a conductor connector attached to a lower surface of the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully