Semiconductor processing method for increasing usable surface area of a semiconductor wafer
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United States of America Patent
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Sep 29, 2009
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Jul 29, 2005
filing date -
Nov 29, 2000
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Abstract
The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.
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