System and method for processor power delivery and thermal management
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United States of America Patent
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N/A
Issued Date -
Dec 15, 2005
app pub date -
Aug 4, 2005
filing date -
Jul 15, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.
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