Components with posts and pads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 24, 2009
Grant Date -
Dec 29, 2005
app pub date -
Jun 24, 2005
filing date -
Oct 6, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
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