Pulse reverse electrolysis of acidic copper electroplating solutions
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United States of America Patent
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Issued Date -
Dec 29, 2005
app pub date -
Jun 25, 2004
filing date -
Jun 25, 2004
priority date (Note) -
Abandoned
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Abstract
Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.
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