Semiconducting device having stacked dice
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 29, 2005
app pub date -
Jun 23, 2004
filing date -
Jun 23, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Some embodiments of the present invention relate to a semiconducting device that includes a base layer and a first layer mounted on an upper surface of the base layer. The first layer includes an upper surface and an opening such that a first die is attached to the upper surface of the base layer within the opening. A second die is attached to the upper surface of the first layer such that the second die is stacked above the first die. The semiconducting device may further include a second layer on the upper surface of the first layer. The second layer includes an opening and an upper surface such that the second die is within the opening in the second layer. In addition, a third die may be attached to the upper surface of the second layer such that the third die is stacked above the first and second dice.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully