System and method for mounting an image capture device on a flexible substrate
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United States of America Patent
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May 11, 2010
Grant Date -
Dec 29, 2005
app pub date -
Jun 25, 2004
filing date -
Jun 25, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).
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