Immersion lithography system with wafer sealing mechanisms
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United States of America Patent
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Mar 10, 2009
Grant Date -
Dec 29, 2005
app pub date -
Jun 23, 2004
filing date -
Jun 23, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An immersion lithography system is disclosed to comprise a fluid containing feature for providing an immersion fluid for performing immersion lithography on a wafer, and a seal ring covering a predetermined portion of a wafer edge for preventing the immersion fluid from leaking through the covered portion of the wafer edge while the fluid is used for the immersion lithography.
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