Thermoelectric module
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United States of America Patent
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N/A
Issued Date -
Jan 5, 2006
app pub date -
Jun 30, 2004
filing date -
Jun 30, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to an embodiment of the invention, a thermoelectric module (TEM) is formed between a first and a second thermally conductive device. A first dielectric layer is deposited over the first thermally conductive device, and interconnects are formed over the dielectric layer. Solder patches are then printed over the interconnects. A second dielectric layer is deposited over the second thermally conductive device. Interconnects and solder patches are deposited over the second dielectric layer. Alternating p- and n-type semiconductor elements are then placed over the patches over the first dielectric layer. The second thermally conductive device is then placed over the first device, and the solder is reflowed.
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