Board mounted heat sink using edge plating
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United States of America Patent
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N/A
Issued Date -
Jan 5, 2006
app pub date -
Jul 2, 2004
filing date -
Jul 2, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a PWB having a heat sink connected to the internal circuits of the PWB that allows for heat dissipation from those internal circuits. In one aspect, the PWB includes at least two insulating layers that are coupled together and that have a conductive layer located therebetween. A conductive interconnect is located on an edge of or through the PWB and is thermally coupled to the conductive layer and a heat sink. The conductive layer forms a thermal conductive path from the conductive layer to the heat sink and thereby allows for heat to be dissipated from within an internal portion of the PWB.
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