Thermoelectric conversion module
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United States of America Patent
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Issued Date -
Jan 12, 2006
app pub date -
Jul 5, 2005
filing date -
Jul 6, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A thermoelectric conversion module for generating power by using a temperature difference and realizing a large-size module with soundness to improve substantial filling density of a thermoelectric semiconductor, including a sliding member having high heat conductivity intervening at least between a heating plate of a high-temperature heat source side and a heat source side electrode portion of a thermoelectric semiconductor and a coupling plate for coupling the heating plate to the cooling plate, wherein the thermoelectric semiconductors and the electrode portions are integrated by being sandwiched between the cooling plate and the heating plate via the sliding member, and the sliding member in the pressurized state accepts relative sliding between the sliding member and the heat source side electrode portion or the heating plate.
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