Interconnect structure that controls spacing between a probe card and a contact substrate
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United States of America Patent
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N/A
Issued Date -
Jan 12, 2006
app pub date -
Sep 8, 2005
filing date -
Mar 12, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect the pads on the second side of the substrate with the pads on the card; wherein at least one of the interconnectors includes at least a portion that does not melt at temperatures in a range from about 183.degree. C. to about 230.degree. C., and the distance between the substrate and the card is determined by a dimension of the at least a portion.
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