Semiconductor chip assembly with metal containment wall and solder terminal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 19, 2008
Grant Date -
Jan 19, 2006
app pub date -
Aug 26, 2005
filing date -
Oct 13, 2000
priority date (Note) -
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Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.
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