Electronic component mounting apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060021215A1
SERIAL NO

11192431

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads in each of the plurality of the rotary tables independently, moving each of the positioning tables for positioning a printed board in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards independently. A component feeding device moves a plurality of component feeding tables having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables intermittently rotating. Therefore, the suction nozzle of the mounting head of each of the rotary tables picks up the electronic component fed to a component pickup position in each of the component feeding units set on each of the component feeding tables, and mounts the component on the printed board on the corresponding XY table.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH INSTRUMENTS CO LTD1-1 SAKADA 1-CHOME OIZUMI-MACHI OURA-GUN GUNMA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asai, Jun Ota-shi, JP 24 258
Izuhara, Koichi Ora-gun, JP 10 72
Kano, Yoshinori Ora-gun, JP 24 343
Kurata, Kenji Ota-shi, JP 4 3
Moriya, Yuji Tatebayashi-shi, JP 5 17
Okamoto, Manabu Isesaki-shi, JP 46 652
Takemura, Ikuo Ora-gun, JP 13 213
Usui, Yoshinao Tatebayashi-shi, JP 9 88
Yamaguchi, Haruhiko Ota-shi, JP 50 120

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