Flexible printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 9, 2006
app pub date -
Aug 4, 2004
filing date -
Aug 4, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flexible printed circuit board (FPC) is provided. The provided FPC includes: an insulating substrate, a conductor layer formed on the insulating substrate and having at least one circuit pattern thereon, an edge connecting layer mounted on at least one side of the insulating substrate, a ripple-shaped boundary formed between the conductor layer and the edge connecting layer, a plurality of connecting terminals positioned at the at least one circuit pattern, and a plurality of gold fingers mounted on the edge connecting layer and interconnected with the plurality of connecting terminals. The ripple-shaped boundary makes the boundary between the gold fingers and the insulating substrate not easily broken off.
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