Method of producing a MEMS device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 2008
Grant Date -
Feb 9, 2006
app pub date -
Aug 9, 2004
filing date -
Aug 9, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully