Method for forming metal contacts on a substrate
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United States of America Patent
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app pub date -
Oct 7, 2005
filing date -
Sep 2, 1999
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Abandoned
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Abstract
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries.
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