Film forming method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 9, 2006
app pub date -
Apr 29, 2005
filing date -
Aug 6, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A technique capable of forming an NiSi film having excellent characteristics, which TiSi.sub.2 or CoSi.sub.2 produced thus far is not able to assume, without damaging a substrate is provided. A film forming material for forming a nickel silicide film or a Nickel film is provided, wherein an Ni source of said film is Ni(PF.sub.3).sub.4.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully