Rugged CSP module system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 12, 2004
filing date -
Aug 12, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A rugged CSP module system and method are disclosed. In one embodiment of the present invention, a unitary mount is attached to a chip scale integrated circuit (CSP) to provide a CSP module with improved temperature cycle performance. In an exemplary system, the mount comprises a two metal layer flexible circuit attached to the CSP. Contacts are distributed along the flexible circuit for attachment to a printed circuit board (PCB). The body of the CSP then stands off from the PCB by the sum of the heights of the CSP contacts, the flex circuit, and the diameter of the contacts distributed along the flex circuit. Consequently, the forces arising from mismatched temperature coefficients of the PCB and CSP are distributed along a longer axis thus improving temperature cycle performance.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully