Ultrasound probe wiring apparatus
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United States of America Patent
Stats
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May 11, 2010
Grant Date -
Feb 16, 2006
app pub date -
Sep 6, 2005
filing date -
Jul 31, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
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