Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
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United States of America Patent
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Nov 3, 2009
Issued Date -
N/A
app pub date -
Dec 16, 2004
filing date -
Aug 19, 2004
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Abstract
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
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