Method of making camera module in wafer level
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United States of America Patent
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Issued Date -
N/A
app pub date -
Apr 1, 2005
filing date -
Sep 2, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photo-sensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengths, with each unit substrate portion being provided with front and backside surfaces on opposite sides thereof. Each photo-sensing semiconductor die defines at least one photo-sensing area opposing the front surface of one unit substrate portion for receiving light impinging upon its backside surface and passing therethrough. A plurality of lens housings are also provided on the substrate, each including at least one lens element disposed in optical alignment with said photo-sensing semiconductor die of one said unit substrate. The plurality of photo-packages are formed by dicing the substrate to separate the unit substrate portions one from the other.
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