Method for reducing lead precipitation during wafer processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 26, 2004
filing date -
Aug 26, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for preventing lead precipitation during wafer processing is disclosed. The method includes singulating a semiconductor wafer having a plurality of solder bumps and applying cold deionized (DI) water to the semiconductor wafer during singulation. Application of the cold DI water reduces or prevents lead precipitation during the singulation process, and thereby reduces the presence of bump oxidation.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully