Method for connecting a chip and a substrate
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United States of America Patent
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N/A
Issued Date -
Mar 9, 2006
app pub date -
Mar 24, 2005
filing date -
Mar 23, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a method of connecting a chip and a substrate, an adhesive having conductive particles is initially provided. The chip and the substrate each include at least one pad on one appropriate side. The adhesive is applied onto one side of the substrate or onto one side of the chip, and the chip and the substrate are connected, the pads being aligned one below the other. Subsequently, this arrangement is pressurized such that in the region between the pads of the chip and the substrate, local compaction of the adhesive results, and the conductive particles adhere to the pads. Finally, the adhesive is hardened.
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