Surface mount LED
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United States of America Patent
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-
N/A
Issued Date -
Mar 9, 2006
app pub date -
Aug 31, 2005
filing date -
Aug 31, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An LED can include a silicon substrate that has a conductive pattern including an LED chip equipped portion, a connection portion, and external electrodes. A glass frame can be anodic-bonded onto the silicon substrate, and can include a through-hole forming a lamp house. An LED chip can be mounted onto the silicon substrate in the through-hole of the glass frame, and a mold portion made of silicone resin can be filled into the through-hole of the glass frame.
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