Testing integrated circuits using high bandwidth wireless technology
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United States of America Patent
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Issued Date -
Mar 9, 2006
app pub date -
Sep 7, 2004
filing date -
Sep 7, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to embodiments of the present invention, a UWB (ultra wideband) communication system is employed to wirelessly test and configure circuits on a die. Baseband signals may be utilized with resulting simplification in CMOS circuits, or orthogonal frequency division multiplexing may be employed to allow more than one communication channel. In one embodiment, the antenna for communicating with circuits on a die is placed between the package and the heat spreader, in electrical contact with a solder bump. In another embodiment, the antennas are placed onto wafer scribe lines, and are used to test chips before the wafer is sawed. Other embodiments are described and claimed.
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