US Patent Application No: 2006/0053,397

Number of patents in Portfolio can not be more than 2000

Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system

ALSO PUBLISHED AS: 8214786

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Abstract

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Embodiments of the present invention include dense, but accessible and well-interconnected component arrangements within multi-component systems, such as high-end multi-processor computer systems, and methods for constructing such arrangements. In a described embodiment, integrated-circuit-containing processing components, referred to as a 'flat components,' are arranged into local blocks of intercommunicating flat components. The local flat-component blocks are arranged into interconnected, primitive multi-local-block repeating units, and the primitive local-block repeating units are layered together in a three-dimensional, regularly repeating structure that can be assembled to approximately fill any specified three-dimensional volume. The arrangement provides for relatively short, direct pathways from the surface of the specified volume to any particular local block and flat component within the three-dimensional arrangement.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.HOUSTON, TX22442

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beausoleil, Raymond G JR Redmond, WA 1 0
Kuekes, Philip J Menlo Park, CA 125 1777
Williams, R Stanley Redwood City, CA 245 2543

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 5,497,471 High performance computer system which minimizes latency between many high performance processors and a large amount of shared memory 3 1994
* 6,268,238 Three dimensional package and architecture for high performance computer 7 1998
 
APPLIED LIFE SCIENCE CORPORATION, THE (1)
* 6,469,901 System and method for cartridge-based, geometry-variant scalable electronic systems 14 2000
 
ELM TECHNOLOGY CORPORATION (1)
* 2005/0023,656 Vertical system integration 79 2003
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 5,729,752 Network connection scheme 21 1993
 
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (1)
* 2002/0160,598 Three dimensional IC package module 2 2002
 
PARICON TECHNOLOGIES CORPORATION (1)
* 2004/0160,742 Three-dimensional electrical device packaging employing low profile elastomeric interconnection 1 2004
 
INFINEON TECHNOLOGIES AG (1)
* 2002/0048,955 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit 1 2001
* Cited By Examiner

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