Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8214786
APP PUB NO 20060053397A1
SERIAL NO

10935845

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Abstract

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Embodiments of the present invention include dense, but accessible and well-interconnected component arrangements within multi-component systems, such as high-end multi-processor computer systems, and methods for constructing such arrangements. In a described embodiment, integrated-circuit-containing processing components, referred to as a “flat components,” are arranged into local blocks of intercommunicating flat components. The local flat-component blocks are arranged into interconnected, primitive multi-local-block repeating units, and the primitive local-block repeating units are layered together in a three-dimensional, regularly repeating structure that can be assembled to approximately fill any specified three-dimensional volume. The arrangement provides for relatively short, direct pathways from the surface of the specified volume to any particular local block and flat component within the three-dimensional arrangement.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX9293

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beausoleil, Raymond G Jr Redmond, US 6 5
Kuekes, Philip J Menlo Park, US 125 2628
Williams, R Stanley Redwood City, US 260 4294

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
5497471 High performance computer system which minimizes latency between many high performance processors and a large amount of shared memory 3 1994
* 6268238 Three dimensional package and architecture for high performance computer 7 1998
 
POLARIS INNOVATIONS LIMITED (1)
* 2002/0048,955 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit 2 2001
 
APPLIED LIFE SCIENCE CORPORATION, THE (1)
* 6469901 System and method for cartridge-based, geometry-variant scalable electronic systems 31 2000
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5729752 Network connection scheme 26 1993
 
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (1)
* 2002/0160,598 Three dimensional IC package module 2 2002
 
PARICON TECHNOLOGIES CORPORATION (1)
* 2004/0160,742 Three-dimensional electrical device packaging employing low profile elastomeric interconnection 2 2004
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
* 9220180 System and methods for scalable parallel data processing and process control 0 2010
* 2012/0147,558 Scalable electronics, computer, router, process control and other module/enclosures employing approximated tesselation(s)/tiling(s) or electronics and other modules from tow modules to columns, rows and arrays with optional deployment utilizing palletization for build out of existing industrial space and/or new construction with nestable wiring applicable from module and assembly level to molecular and atomic levels 1 2010
* Cited By Examiner

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