US Patent Application No: 2006/0053,397

Number of patents in Portfolio can not be more than 2000

Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system

ALSO PUBLISHED AS: 8214786

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Abstract

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Embodiments of the present invention include dense, but accessible and well-interconnected component arrangements within multi-component systems, such as high-end multi-processor computer systems, and methods for constructing such arrangements. In a described embodiment, integrated-circuit-containing processing components, referred to as a 'flat components,' are arranged into local blocks of intercommunicating flat components. The local flat-component blocks are arranged into interconnected, primitive multi-local-block repeating units, and the primitive local-block repeating units are layered together in a three-dimensional, regularly repeating structure that can be assembled to approximately fill any specified three-dimensional volume. The arrangement provides for relatively short, direct pathways from the surface of the specified volume to any particular local block and flat component within the three-dimensional arrangement.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.HOUSTON, TX27704

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beausoleil, Raymond G JR Redmond, WA 7 2
Kuekes, Philip J Menlo Park, CA 206 1985
Williams, R Stanley Portola Valley, CA 388 2971

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