Stacked die module and techniques for forming a stacked die module
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United States of America Patent
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Mar 6, 2007
Issued Date -
N/A
app pub date -
Nov 4, 2005
filing date -
May 8, 2002
priority date (Note) -
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Abstract
Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.
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