Structural design for flip-chip assembly
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United States of America Patent
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Nov 21, 2006
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app pub date -
Sep 22, 2004
filing date -
Sep 22, 2004
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Abstract
An integrated circuit package comprises a semiconductor die located on a substrate in a flip-chip configuration, an encapsulant layer overlying the non-active surface of the semiconductor die and at least a portion of the surface of the substrate adjacent the die, and a heat spreader comprising a thermally conductive material. The heat spreader directly interfaces to a top surface of the encapsulant layer overlying the die and the substrate. This package provides physical protection during handling and reduced die stress and warpage.
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