Modular liquid cooling of electronic assemblies
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United States of America Patent
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Apr 8, 2008
Grant Date -
Mar 30, 2006
app pub date -
Sep 30, 2004
filing date -
Sep 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.
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