High-temperature reduced size manometer
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United States of America Patent
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Apr 10, 2007
Grant Date -
Apr 6, 2006
app pub date -
Sep 30, 2004
filing date -
Sep 30, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure-sensing device and method for making and using such device having a temperature differential between two portions of the device is disclosed. A solid-state heat pump, such as a thermo-electric cooler (TEC), is used to pump heat from a cold portion to a hot portion of the device. A pressure sensor sensing the pressure of a hot fluid is disposed in the hot portion of the device, and sensor electronics are disposed in the cold portion of the device.
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