Electropolishing electrolyte and method for planarizing a metal layer using the same

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United States of America Patent

PATENT NO 7501051
APP PUB NO 20060070888A1
SERIAL NO

11051163

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Abstract

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The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.

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Patent Owner(s)

Patent OwnerAddress
BASF ELECTRONIC MATERIALS TAIWAN LTD6F-5 NO 188 SEC 5 NANKING E ROAD SHUN SHAN DISTRICT TAIPEI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dai, Bau Tong Baushan Township, Hsinchu County, TW 1 13
Liu, Sue Hong Pingtung, TW 1 13
Shieh, Jia Min Hsinchu, TW 1 13

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