Semiconductor device and method for producing same
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United States of America Patent
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N/A
Issued Date -
Apr 6, 2006
app pub date -
Oct 3, 2005
filing date -
Oct 4, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer-level chip scale package in which a semiconductor element is encapsulated in a hollow structure that is not easily filled with moisture is provided. Also provided is a method for producing such a package. The semiconductor device has a semiconductor substrate; a semiconductor element provided in an element region on one principal surface of the semiconductor substrate; a sealing material provided on the one principal surface and enclosing the element region: and a light transmission material adhered to the semiconductor substrate via the sealing material. The light transmission material and the element region define a hollow between the light transmission material and the element region. In the light transmission material, through holes penetrating through the principal surfaces of the light transmission material are provided. The inner side opening of each of the through holes communicates with the hollow.
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