Method for manufacturing an electronic module, and an electronic module
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United States of America Patent
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Issued Date -
Apr 13, 2006
app pub date -
Feb 25, 2004
filing date -
Feb 26, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is attached to the surface of a conductive layer and electrical and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.
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